Avicenna's laser skiving capability, the ability to cut off thin layers of material, is an extension of our laser ablation process, which does not burn or melt material, but instead removes material by breaking its molecular bonds, leaving the underlying material layers intact. Avicenna's laser skiving process is essentially a controlled-depth laser ablation process applied to tubing and other cylindrical objects. We use the term skiving, rather than ablation, when we remove material from the entire circumference of a cylindrical object.

Laser skiving allows Avicenna to accurately remove material from the outside diameter of a tube, creating either stepped or tapered regions. When located in the middle of a catheter, stepped regions facilitate the placement of marker bands that aid the catheter's positioning within the body. When located at the tip of a sectioned tube, tapered regions facilitate its insertion or connection to precise orifices.

In composite tube, consisting of disparate material layers, Avicenna can laser skive to the exact depth of an underlying material layer. When a pliant inner material is encased by a rigid outer material, Avicenna's laser skiving enables customers to achieve flexible bend or tip regions by ablating the rigid material. Laser skiving is also useful to customers whose tube product contains an embedded metal coil and who wish to have the coil exposed for subsequent crimping, welding, or over-molding processes.