Avicenna can laser drill slots, grooves, and holes of any shape into many of the specialized polymers used in the medical and electronics industries. In addition to through-hole drilling, Avicenna has the ability to control the depth of drilling. This capability allows Avicenna to meet specifications that require the complete and clean drilling of a top material layer while leaving the underlying material layer(s) untouched.

When multi-lumen catheters are loaded into Avicenna's rotary workstations, the ability to control-depth drill allows Avicenna to produce precise holes at select locations in the outer lumens, leaving the center lumen untouched.

When flex-circuit piece parts or poly/metal laminate sheets are loaded into Avicenna's 24" X-Y workstations, the ability to control depth drill allows Avicenna to produce micro-vias through the poly layer to the conductive layer.

Avicenna's laser drilling process has produced holes as small as 0.002" in Polyimide, Polyester, and Copper for its customers in the flex-circuit industry. The holes Avicenna drills are free of burrs, lips, melting, flashing, and burning.