Avicenna's laser ablation process does not burn or melt coatings, but instead removes coatings from substrates by breaking the molecular bonds of the coating material. Properly performed laser ablation results in a clean substrate that is unharmed, and a border between coated and uncoated regions that is perfectly uniform, and free of burrs, strands, and discoloration.

Avicenna's laser ablation techniques have removed coatings as thick as 0.005" from all manner of substrates. Avicenna has adapted its part handling systems to enable the precise laser ablation of coated electrical test probes, coated wafers and leadframes, medical surgical probes, fully populated circuit boards, pre-cut lengths of wire and tube, and all types of spooled wire.

One of Avicenna's distinguishing capabilities is the ablation of coatings from spooled fine wire. Avicenna has extensive experience handling spooled fine wire and has a fleet of automated wire handling machines dedicated to laser ablation. Avicenna's wire ablation systems can precisely ablate wire as fine as 52AWG, and perform the ablation in either a continuous reel-to-reel process or in a pull and cut process, with ablation length tolerances of 0.002".

Another distinguishing capability is our removal of coatings from sites plated with soft metals such as gold and tin/lead. Avicenna is able to remove coatings while leaving the underlying plated metals intact, without etching or heat effect (orange-peeling). This is important when coated wafers and/or circuit boards need their coatings removed from termination and test sites, wire-bond pads, sensor contacts, etc. This type of controlled ablation becomes more challenging as coating thickness increases. Avicenna has repeatedly demonstrated its ability to overcome such challenges, particularly in the already difficult task of ablating Parylene. Avicenna has ablated Parylene coatings as thick as 0.002" from gold plated nickel pads without ever breaching the gold plating.